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Fabrication of WS2/GaN p-n junction by wafer-scale WS2 thin film transfer

机译:通过晶圆级WS2薄膜转移制造WS2 / GaN p-n结

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摘要

High quality wafer-scale free-standing WS2 grown by van der Waals rheotaxy (vdWR) using Ni as a texture promoting layer is reported. The microstructure of vdWR grown WS2 was significantly modified from mixture of crystallites with their c-axes both parallel to (type I) and perpendicular to (type II) the substrate to large type II crystallites. Wafer-scale transfer of vdWR grown WS2 onto different substrates by an etching-free technique was demonstrated for the first time that utilized the hydrophobic property of WS2 and hydrophilic property of sapphire. Our results show that vdWR is a reliable technique to obtain type-II textured crystallites in WS2, which is the key factor for the wafer-scale etching-free transfer. The transferred films were found to be free of observable wrinkles, cracks, or polymer residues. High quality p-n junctions fabricated by room-temperature transfer of the p-type WS2 onto an n-type GaN was demonstrated with a small leakage current density of 29.6 μA/cm2 at-1 V which shows superior performances compared to the directly grown WS2/GaN heterojunctions.
机译:据报道,范德华(van der Waals)流变法(vdWR)使用Ni作为质构促进层,生长出高质量的晶圆级独立式WS2。 vdWR生长的WS2的微观结构从微晶混合物(其C轴既平行于(I型)又垂直于(II型)衬底)转变为大型II型微晶。首次证明了利用无蚀刻技术将vdWR生长的WS2晶片级转移到不同的基板上,该技术利用了WS2的疏水性和蓝宝石的亲水性。我们的结果表明,vdWR是在WS2中获得II型纹理微晶的可靠技术,这是晶圆级无蚀刻转移的关键因素。发现转移的膜没有可观察到的皱纹,裂缝或聚合物残留物。证明了通过将p型WS2室温转移到n型GaN上制成的高质量pn结,在-1 V时泄漏电流密度为29.6μA/ cm2,与直接生长的WS2 /相比,其优越的性能GaN异质结。

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